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US 2024/0343852 A1Published application
Resin composition and application thereof
AssigneeHuawei Technologies Co., Ltd.
InventorsMin Chao CHUANG, Hailiang ZOU, Guiyun CHEN, Tao LIU
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Abstract
Embodiments of this disclosure provide a resin composition and an disclosure thereof. The resin composition includes a polyurethane acrylate and a curing monomer, the curing monomer includes a compound containing a free radical polymerizable group and/or a compound containing a moisture curable group, and a weight-average molecular weight of the curing monomer is greater than or equal to 300.
Claims20
A resin composition, comprising:
- a polyurethane acrylate;
- and
- a curing monomer, wherein the curing monomer comprises at least one of a compound containing a free radical polymerizable group or a compound containing a moisture curable group, and a weight-average molecular weight of the curing monomer is greater than or equal to 300.
A bonding structure, comprising:
- a first bonding member,
- a second bonding member, and
- a bonding part disposed between the first bonding member and the second bonding member, and the bonding part comprises a curing product obtained by curing a resin composition, wherein the resin composition comprises:
- a polyurethane acrylate;
- and
- a curing monomer, wherein the curing monomer comprises at least one of a compound containing a free radical polymerizable group and/or a compound containing a moisture curable group, and a weight-average molecular weight of the curing monomer is greater than or equal to 300.
3 more elements
A device, wherein the device uses a resin composition, wherein the resin composition comprises:
- a polyurethane acrylate;
- and
- a curing monomer, wherein the curing monomer comprises at least one of a compound containing a free radical polymerizable group or a compound containing a moisture curable group, and a weight-average molecular weight of the curing monomer is greater than or equal to 300.
Dependencies are inferred from the claim text.