High temperature metal seals for vacuum segregation
AssigneeApplied Materials, Inc.
InventorsMuhannad Mustafa, Sanjeev Baluja
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AssigneeApplied Materials, Inc.
InventorsMuhannad Mustafa, Sanjeev Baluja
Estimating the term…
Embodiments of the present disclosure are related to directed to a pressure seal for a process chamber. The pressure seal comprises a bottom portion, a compressible middle portion on the bottom portion, and a top portion on the compressible middle portion. The disclosed pressure seal is configured to reduce pumping time of a process region in an interior volume of a processing chamber compared to a process chamber that does not include a pressure seal. Processing chambers including the disclosed pressure seal are configured to process a semiconductor substrate at high temperatures, such as a temperature of greater than or equal to 350° C. Methods of sealing a processing chamber using the disclosed pressure seal are also described.
A pressure seal comprising:
A pressure seal comprising:
A processing chamber comprising:
Dependencies are inferred from the claim text.