Assembly verification method and electronic device

An assembly verification method, applied to an electronic device, wherein the method comprises:

• obtaining, by the electronic device, a three-dimensional tolerance dimension chain of a to-be-mounted component and a mounted component;
• determining, by the electronic device, coordinates of a high-risk assembly position of each test point in the to-be-mounted component when the to-be-mounted component and the mounted component are assembled;
• determining, by the electronic device based on the three-dimensional tolerance dimension chain and the coordinates of a high-risk assembly position of each test point in the to-be-mounted component, a gap value distribution interval when the to-be-mounted component and the mounted component are assembled;
• and
• determining, by the electronic device based on the gap value distribution interval, whether there is an interference when the to-be-mounted component and the mounted component are assembled;
• and
• wherein determining, by the electronic device, coordinates of the high-risk assembly position of each test point in the to-be-mounted component when the to-be-mounted component and the mounted component are assembled comprises:
• calculating, by the electronic device, a minimum nominal gap value between each test point in the to-be-mounted component and the mounted component when the to-be-mounted component and the mounted component are assembled;
• and
• determining, by the electronic device, the coordinates of a high-risk assembly position of the respective test point based on the minimum nominal gap value.

An electronic device, comprising a memory and a processor, wherein the memory stores a computer program, and the processor is configured to invoke the computer program, and invoking the computer program causes the electronic device to:

• obtain a three-dimensional tolerance dimension chain of a to-be-mounted component and a mounted component;
• determine coordinates of a high-risk assembly position of each test point in the to-be-mounted component when the to-be-mounted component and the mounted component are assembled;
• determine, based on the three-dimensional tolerance dimension chain and the coordinates of a high-risk assembly position of each test point in the to-be-mounted component, a gap value distribution interval when the to-be-mounted component and the mounted component are assembled;
• and
• determine, based on the gap value distribution interval, whether there is an interference when the to-be-mounted component and the mounted component are assembled;
• and
• wherein determining coordinates of the high-risk assembly position of each test point in the to-be-mounted component when the to-be-mounted component and the mounted component are assembled comprises:
• calculating a minimum nominal gap value between each test point in the to-be-mounted component and the mounted component when the to-be-mounted component and the mounted component are assembled;
• and
• determining the coordinates of a high-risk assembly position of the respective test point based on the minimum nominal gap value.

A non-transitory computer-readable storage medium, wherein the non-transitory computer-readable storage medium stores a computer program or instructions, and when the computer program or the instructions are run, and electronic device is caused to:

• obtain a three-dimensional tolerance dimension chain of a to-be-mounted component and a mounted component;
• determine coordinates of a high-risk assembly position of each test point in the to-be-mounted component when the to-be-mounted component and the mounted component are assembled;
• determine, based on the three-dimensional tolerance dimension chain and the coordinates of a high-risk assembly position of each test point in the to-be-mounted component, a gap value distribution interval when the to-be-mounted component and the mounted component are assembled;
• and
• determine, based on the gap value distribution interval, whether there is an interference when the to-be-mounted component and the mounted component are assembled;
• and
• wherein determining coordinates of the high-risk assembly position of each test point in the to-be-mounted component when the to-be-mounted component and the mounted component are assembled comprises:
• calculating a minimum nominal gap value between each test point in the to-be-mounted component and the mounted component when the to-be-mounted component and the mounted component are assembled;
• and
• determining the coordinates of a high-risk assembly position of the respective test point based on the minimum nominal gap value.