US 2024/0270528 A1 · IMPARTING A THREE-DIMENSIONAL PROFILE INTO AN ADHESIVE SUBSTRATE

Abstract

Methods and apparatus to form elevated profiles in mounted turn-up raised profile tapes for paper processing. In some embodiments, the raised profile tape may be a combination of a tape substrate coated on one side with a web grabbing adhesive and on the other side with a mounting adhesive and a release liner having a release liner substrate fully coated on a first side with a release layer and zone-coated on a second side with a release layer. In some embodiments, an elevated profile may be formed during the application of the raised profile tape with specialized apparatus.

Claims20

Dependent claims

A method for imparting a three-dimensional profile onto a two-dimensional adhesive substrate, the method comprising:

a. providing a substrate dispenser configured to house a roll of the two-dimensional adhesive substrate;
b. dispensing the two-dimensional adhesive substrate from the substrate dispenser, wherein the two-dimensional adhesive substrate is dispensed with a dispensed portion extending parallel to a shape forming plane, utilizing a dispensing roller integrated within the substrate dispenser;
c. advancing the dispensed portion of the two-dimensional adhesive substrate over a three-dimensional forming feature that extends from the substrate dispenser;
and
d. imparting the three-dimensional profile onto the dispensed portion of the two-dimensional adhesive substrate as it advances over the three-dimensional forming feature.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

18/605,599Filed 14 Mar 2024

Priority

18 Jan 2023

Published

15 Aug 2024

Term ends

Not estimatedThe source records don’t support an estimate.

Classification10 codes

B65H 19/262
Cutting-off the web running to the wound web roll: using a thin or filamentary material which is wound on the new roll
B65H 35/0033
For delivering pressure-sensitive adhesive tape: and affixing it to a surface
C09J 7/21
Characterised by their carriers: paper; Textile fabrics
C09J 7/203
Characterised by their carriers: characterised by the structure of the release feature on the carrier layer

Imparting a three-dimensional profile into an adhesive substrate

Life of this patent

Imparting a three-dimensional profile into an adhesive substrate

Life of this patent

Abstract

Claims20