US 2024/0268131 A1 · OPTICAL SIGNALING FOR STACKED MEMORY DEVICE ARCHITECTURES

Abstract

Methods, systems, and devices for near memory photonics are described. A memory device may include an optical interface, which may include an array of optical emitters and optical receivers, to convert between electrical signaling and optical signaling. For example, a vertical stack of memory dies may be coupled with an interface component which includes the optical interface. Optical signaling may be carried over one or more optical channels to a host device, and the host device may include an optical interface to convert the optical signaling back to electrical signaling. In some examples, the interface component may be positioned above the vertical stack of memory dies. Alternatively, the interface component may be positioned below the stack of memory dies, and may extend horizontally beyond the stack of memory dies, forming a porch section. In such cases, the optical interface may be distributed across the porch section.

Claims20

Dependent claims

An apparatus, comprising:

a plurality of memory dies arranged in a vertical stack;
and
an interface component disposed above the plurality of memory dies and comprising:
a plurality of first transceivers coupled with the plurality of memory dies via respective sets of first channels, the plurality of first transceivers configured to communicate first signaling via the respective sets of first channels;
and
a second transceiver configured to communicate second signaling via a set of second channels, the set of second channels being optical channels,
wherein the interface component is configured to convert between the first signaling and the second signaling.

4 more elements

Dependencies are inferred from the claim text.

Optical signaling for stacked memory device architectures

Life of this patent

Optical signaling for stacked memory device architectures

Life of this patent

Abstract

Claims20