Thermal module and electronic device thereof
AssigneePegatron Corporation
InventorSHIH-HAO WANG
Life of this patent
Estimating the term…
Abstract
The present invention provides a thermal module and an electronic device thereof. The thermal module is used in an electronic device. The electronic device has a shell and a circuit board. A heating element is arranged on the circuit board. The thermal module includes a thermal pad and a heat spreader. The thermal pad is arranged on the circuit board in contact with the heating element. The heat spreader is arranged within the shell and in contact with the thermal pad, and the heat spreader extends along the circuit board and the shell and is bent to conform to an internal shape of the shell.
Claims6
A thermal module, used in an electronic device, the electronic device having a shell and a circuit board, a heating element being arranged on the circuit board, and the thermal module comprising:
- a thermal pad, arranged on the circuit board in contact with the heating element;
- and
- a heat spreader, arranged within the shell and in contact with the thermal pad, the heat spreader extending along the circuit board and the shell and being bent to conform to an internal shape of the shell.
An electronic device, comprising:
- a shell;
- a circuit board, arranged within the shell and having a heating element;
- and
- a thermal module, comprising:
- a thermal pad, arranged on the circuit board in contact with the heating element;
- and
- a heat spreader, arranged within the shell and in contact with the thermal pad, the heat spreader extending along the circuit board and the shell and being bent to conform to an internal shape of the shell.
Dependencies are inferred from the claim text.