Light-emitting device and method for manufacturing the same

A light-emitting device, comprising:

• a circuit substrate;
• a plurality of light-emitting elements disposed over the circuit substrate;
• a plurality of connectors disposed between the plurality of light-emitting elements and circuit substrate respectively;
• and
• a plurality of eutectic patterns disposed between the plurality of light-emitting elements and the plurality of connectors respectively,
• wherein a first connector of the plurality of connectors is disposed between a first light-emitting element of the plurality of light-emitting elements and circuit substrate, a second connector of the plurality of connectors is disposed between a second light-emitting element of the plurality of light-emitting elements and circuit substrate, and a thickness of the first connector is equal to a sum of a thickness of the eutectic pattern and a thickness of the second connector.

A method for manufacturing a light-emitting device, comprising:

• providing a light-emitting device to be repaired, wherein the light-emitting device to be repaired includes:
• a circuit substrate;
• a first light-emitting element disposed at a first site on the circuit substrate, and a second site on the circuit substrate is not occupied by the first light-emitting element;
• and
• a first eutectic pattern disposed only between the circuit substrate and the first light-emitting element;
• providing a carrier with an adhesive layer formed on its surface;
• disposing a second light-emitting element at a third site on the carrier only, wherein the third site corresponds to the second site;
• and
• transferring the second light-emitting element from the carrier to the second site on the circuit substrate, wherein a first spacing between the first light-emitting element and the circuit substrate is greater than a second spacing between the second light-emitting element and the circuit substrate.