US 2024/0266471 A1Published application

Display device and method of manufacturing the same

AssigneeSamsung Display Co., Ltd.

InventorsYonghan LEE, Heejun YANG

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Abstract

A display device includes a substrate, a sub-pixel electrode disposed on the substrate, an insulating layer disposed on the sub-pixel electrode with an opening overlapping the sub-pixel electrode, a first metal bank layer disposed on the insulating layer with a first opening overlapping the sub-pixel electrode, a second metal bank layer disposed on the first metal bank layer with an opening overlapping at least a portion of the first opening, an intermediate insulating layer disposed between the first metal bank layer and the second metal bank layer, with an opening overlapping at least a portion of the first opening, and including an insulating material, an emission layer overlapping the sub-pixel electrode in the first opening of the first metal bank layer, an opposite electrode overlapping the emission layer in the first opening of the first metal bank layer, and a first inorganic encapsulation layer disposed on the opposite electrode.

Claims20

Dependent claims

A display device comprising:

a substrate;
a sub-pixel electrode disposed on the substrate;
an insulating layer disposed on the sub-pixel electrode, wherein an opening is defined through the insulating layer to overlap the sub-pixel electrode;
a first metal bank layer disposed on the insulating layer, wherein a first opening is defined through the first metal bank layer to overlap the sub-pixel electrode;
a second metal bank layer disposed on the first metal bank layer, wherein an opening is defined through the second metal bank layer to overlap at least a portion of the first opening;
an intermediate insulating layer disposed between the first metal bank layer and the second metal bank layer and including an insulating material, wherein an opening is defined through the intermediate insulating layer to overlap at least a portion of the first opening;
an emission layer overlapping the sub-pixel electrode and disposed in the first opening of the first metal bank layer;
an opposite electrode overlapping the emission layer and disposed in the first opening of the first metal bank layer;
and
a first inorganic encapsulation layer disposed on the opposite electrode.

7 more elements

A method of manufacturing a display device, the method comprising:

forming a sub-pixel electrode on a substrate;
forming a protective layer on at least a portion of the sub-pixel electrode;
forming, on the sub-pixel electrode, an insulating layer with an opening formed therethrough to overlap the sub-pixel electrode;
forming, on the insulating layer, a first metal bank layer with a first opening formed therethrough to overlap the sub-pixel electrode;
forming, on the first metal bank layer, an intermediate layer with an opening formed therethrough to overlap the first opening;
forming, on the intermediate layer, an intermediate insulating layer with an opening formed therethrough to overlap at least a portion of the first opening;
forming, on the intermediate insulating layer, a second metal bank layer with an opening formed therethrough to overlap at least a portion of the first opening;
forming an emission layer on the sub-pixel electrode in the first opening of the first metal bank layer;
forming an opposite electrode on the emission layer in the first opening of the first metal bank layer;
and
forming a first inorganic encapsulation layer on the opposite electrode.

8 more elements

Dependencies are inferred from the claim text.

Facts

Application: 18/385,933Filed 1 Nov 2023
Priority: KR 10-2023-00162617 Feb 2023
Published: 8 Aug 2024
Term ends: Not estimatedThe source records don’t support an estimate.

Classification11 codes

H10H 20/8312
Characterised by their shape: extending at least partially through the bodies
H10H 20/84
Constructional details: coatings, e.g. passivation layers or antireflective coatings
H10H 20/854
Encapsulations: characterised by their material, e.g. epoxy or silicone resins
H10H 20/857
Packages: interconnections, e.g. lead-frames, bond wires or solder balls

Family

No related US applications are recorded in the indexed filing history.

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