Miniaturized lens packaging module, preparation method of the lens packaging module, and electronic device having the lens packaging module

A preparation method of a lens packaging module, the preparation method comprising:

• arranging a passive component on a first surface of a circuit board, wherein the circuit board defines a through hole;
• arranging an encapsulation portion on the first surface of the circuit board, wherein the encapsulation portion comprises a main body portion covering the passive component;
• arranging a photosensitive chip on a second surface of the circuit board, wherein the second surface is opposite to the first surface;
• arranging a lens assembly on the encapsulation portion, wherein the lens assembly and the photosensitive chip are located at opposite sides of the through hole, along a thickness direction, an orthographic projection of the passive component overlaps at least partially with an orthographic projection of the lens assembly.

An electronic device comprising:

• a lens packaging module comprising:
• a circuit board comprising a first surface and a second surface opposite to the first surface, the circuit board further defining a through hole extending through the first surface and the second surface;
• a passive component;
• a photosensitive chip, wherein the passive component and the photosensitive chip are arranged on the first surface and the second surface, respectively, and the photosensitive chip corresponds to the through hole;
• an encapsulation portion comprising a main body portion arranged on the first surface, wherein the main body portion covers the passive component;
• and
• a lens assembly formed on the encapsulation portion and corresponding to the through hole, wherein, along a thickness direction, an orthographic projection of the passive component overlaps at least partially with an orthographic projection of the lens assembly.