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US 2024/0266311 A1Published application
Solderable electronic device and method for fabricating the same
AssigneeInfineon Technologies AG
InventorsAlexander Roth, Andreas Waterloo
Life of this patent
Estimating the term…
Abstract
A solderable electronic device includes: a base including one or more of a semiconductor die and a power electronic substrate; a first layer arranged over the base, the first layer including a solid reducing agent; and a solder preform arranged over the first layer. The solid reducing agent is configured to reduce a solder material of the solder preform during a soldering process.
Claims18
A solderable electronic device, comprising:
- a base comprising one or more of a semiconductor die and a power electronic substrate;
- a first layer arranged over the base, the first layer comprising a solid reducing agent;
- and
- a solder preform arranged over the first layer,
- wherein the solid reducing agent is configured to reduce a solder material of the solder preform during a soldering process.
2 more elements
A method for fabricating a solderable electronic device, the method comprising:
- providing a base comprising one or more of a semiconductor die and a leadframe;
- arranging a first layer over the base, the first layer comprising a solid reducing agent;
- and
- arranging a solder preform over the first layer,
- wherein the solid reducing agent is configured to reduce a solder material of the solder preform during a soldering process.
2 more elements
Dependencies are inferred from the claim text.