Semiconductor module

A semiconductor module comprising:

• a board comprising:
• a chip area and a tab area sequentially arranged in a first direction, and
• at least one notch or at least one protrusion in the tab area;
• a semiconductor chip provided on the chip area;
• a plurality of signal tabs provided on the tab area and configured to transmit an electrical signal to or receive an electrical signal from the semiconductor chip;
• and
• an anti-static portion having conductivity, the anti-static portion being provided in the tab area, and spaced apart from the plurality of signal tabs,
• wherein the anti-static portion is provided either adjacent to the at least one notch or on the at least one protrusion.

A semiconductor module configured to be inserted into a socket in a first direction, the semiconductor module comprising:

• a board comprising a chip area and a tab area sequentially arranged in the first direction;
• a semiconductor chip provided on the chip area;
• a plurality of signal tabs provided on the tab area;
• and
• an anti-static portion having conductivity, the anti-static portion being provided in the tab area and spaced apart from the plurality of signal tabs,
• wherein the plurality of signal tabs and the anti-static portion are sequentially arranged in the first direction, and
• wherein the anti-static portion and the plurality of signal tabs are configured to sequentially contact a connection pin inside the socket upon insertion of the semiconductor module into the socket.