Bonding structures in semiconductor packaged device and method of forming same

A device comprising:

• a first substrate, the first substrate having a center region at an intersection of diagonals of the first substrate in a plan view;
• and
• a die structure attached to the first substrate, the die structure comprising:
• a second substrate,
• a plurality of die regions on the second substrate,
• first seal rings on the second substrate, each of the first seal rings surrounding a corresponding one of the die regions in the plan view,
• a second seal ring surrounding the first seal rings in the plan view, and
• a plurality of connectors attached to the first substrate each of the connectors having an elongated plan-view shape, a long axis of the elongated plan-view shape of each of the plurality of connectors being oriented toward the center region of the first substrate.