Power semiconductor module with vibration dampeners and power electronics system including the power semiconductor module

A power electronics system, comprising:

• a power semiconductor module that includes an electrically insulative enclosure, a plurality of power semiconductor dies attached to a substrate inside the electrically insulative enclosure, a lead frame or clip frame disposed above the plurality of power semiconductor dies inside the electrically insulative enclosure and electrically connected to the plurality of power semiconductor dies, a plurality of pins attached to the lead frame or clip frame and protruding through a first side of the electrically insulative enclosure to form an electrical connection interface outside the electrically insulative enclosure, and a plurality of vibration dampeners attached to the lead frame or clip frame and protruding through the first side of the electrically insulative enclosure separate from the electrical connection interface;
• and
• a circuit board that includes a plurality of electronic components mounted thereon, a plurality of first openings that receive the plurality of pins, and a plurality of second openings that receive the plurality of vibration dampeners,
• wherein the plurality of vibration dampeners is configured to dampen vibrations at the circuit board and does not affect electrical operation of the power semiconductor module.