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US 2024/0266298 A1Published application
Fan-Out Package Having a Main Die and a Dummy Die
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYan-Fu Lin, Chen-Hua Yu, Meng-Tsan Lee, Wei-Cheng Wu, Hsien-Wei Chen
Life of this patent
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Abstract
A fan-out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die.
Claims20
A method, comprising:
- placing a functional die and a dummy die on a first substrate, wherein the functional die comprises a first insulating layer overlying a first substrate, wherein the dummy die comprises a second insulating layer overlying a second substrate, wherein the dummy die is free of active devices;
- disposing a molding compound along sidewalls of the functional die and the dummy die;
- and
- forming a redistribution structure over the functional die, the dummy die, and the molding compound, wherein forming the redistribution structure comprises forming a first conductive line electrically coupled to the functional die, wherein forming the redistribution structure comprises forming a first external contact on a side opposite the functional die.
1 more element
A method, comprising:
- placing a functional die on a first surface, the functional die comprising a first substrate and a first insulating layer on the first substrate;
- placing a dummy die on the first surface, the dummy die comprising a second substrate and a second insulating layer on the second substrate;
- wherein the first insulating layer and the second insulating layer face a same direction relative to the first surface;
- placing a molding material on the first surface, the molding material extending between the dummy die and the functional die, wherein the molding material completely covers sidewalls of the second insulating layer;
- and
- forming a redistribution structure over the functional die and the molding material, wherein the redistribution structure comprises an external contact electrically coupled to the functional die.
3 more elements
A method, comprising:
- placing a functional die on a first surface of a first structure, the functional die comprising a first substrate and a first insulating layer on the first substrate, wherein the first substrate is interposed between the first structure and the first insulating layer;
- placing a dummy die on the first surface of the first structure laterally spaced apart from the functional die, the dummy die comprising a second substrate and a second insulating layer on the second substrate, wherein the second substrate is interposed between the first structure and the second insulating layer;
- placing a molding material on the first surface, the molding material extending between the dummy die and the functional die, wherein the molding material completely covers sidewalls of the second insulating layer, wherein an electrical contact of the functional die is exposed after placing the molding material;
- and
- forming a redistribution structure over the functional die and the molding material, wherein the redistribution structure comprises an external contact electrically coupled to the electrical contact of the functional die.
2 more elements
Dependencies are inferred from the claim text.