Direct cooling type semiconductor package unit and manufacturing method thereof

A method of manufacturing a direct cooling type semiconductor package unit, the method comprising:

• a device and substrate preparation step of stacking a material layer for forming a semiconductor device on one side of a substrate made of a material comprising silicon, forming the semiconductor device by performing a semiconductor process on the material layer, and forming a flow channel through which a cooling fluid flows on the other side of the substrate to enable direct cooling of the semiconductor device using the cooling fluid;
• a heat sink unit preparation step of disposing a heat sink unit on a lower side of the substrate, the heat sink unit comprising a flow path forming portion in which a fluid movement region communicating with the flow channel of the substrate is formed;
• a wiring step of disposing a packaging block surrounding the substrate on the heat sink unit for packaging the semiconductor device and electrically connecting an electrode placed on the packaging block to the semiconductor device;
• a laminating step of coupling a thin film type structure that is moldable to have pattern structures of various shapes through a lithography process to an upper surface of the heat sink unit;
• a pattern forming step of forming a pattern structure that allows the fluid movement region of the heat sink unit and the flow channel of the substrate to communicate with each other by performing an exposure and development process on the thin film type structure;
• and
• a coupling step of coupling the substrate to the heat sink unit by using the thin film type structure.