Package structure and manufacturing method thereof

A manufacturing method of a package structure, comprising:

• disposing a first package component on a second package component, wherein the first package component comprises a semiconductor die encapsulated by an insulating encapsulation that comprises a base layer and a plurality of fillers partially embedded in the base layer;
• forming a thermal coupling structure on the first package component, wherein the thermal coupling structure comprises a metallic layer overlying the semiconductor die and extending to cover the fillers that are accessibly revealed by the base layer;
• and
• disposing a heat dissipating component on the second package component, wherein the thermal coupling structure is interposed between the heat dissipating component and the first package component.

A manufacturing method of a package structure, comprising:

• forming a package component, wherein the package component comprises a semiconductor die laterally covered by an insulating encapsulation;
• forming a thermal coupling structure on the package component, wherein the thermal coupling structure comprises a metallic layer overlying a rear surface of the semiconductor die and conformally covering a roughed surface of the insulating encapsulation;
• and
• disposing a heat dissipating component on the thermal coupling structure, wherein the heat dissipating component is thermally coupled to the semiconductor die through the thermal coupling structure.