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US 2024/0266241 A1Published application
Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorSota YAMAGUCHI
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Abstract
A semiconductor device includes a substrate, a semiconductor element on the substrate, and a cooler that cools the substrate, wherein the cooler includes a cooling body having a first part, and a second part protruding from the first part toward the substrate, and a cooling fin fixed within the second part, the cooling fin being exposed to an exterior of the device on a side thereof facing away from the substrate.
Claims7
A semiconductor device, comprising:
- a substrate;
- a semiconductor element on the substrate;
- and
- a cooler that cools the substrate, wherein
- the cooler includes
- a cooling body having a first part, and a second part protruding from the first part toward the substrate, and
- a cooling fin fixed within the second part, the cooling fin being exposed to an exterior of the device at a side thereof opposite to a side facing the substrate.
4 more elements
Dependencies are inferred from the claim text.