US 2024/0266204 A1Published application

Securing a wafer to a chuck

AssigneeApplied Materials Israel Ltd.

InventorsDekel Yedid, Eytan Hendel

Life of this patent

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Abstract

A system that includes a vacuum module that includes a first vacuum source, a first vacuum propagation path, a second vacuum source, and a second vacuum propagation path. The first vacuum source is configured to provide first vacuum of a first vacuum level, via the first vacuum propagation path, to a chuck. The chuck is mounted on a mechanical stage. The second vacuum source is configured to provide second vacuum at a second vacuum level, via the second vacuum propagation path, to the chuck. The second vacuum level exceeds the first vacuum level. The chuck is configured to apply at least one of the first vacuum or the second vacuum to the wafer. The first vacuum propagation path is configured to follow movements of the chuck. The second vacuum propagation path is configured to remain static despite the movements of the chuck.

Claims19

Dependent claims

A system for securing a wafer to a chuck, the system comprises:

a vacuum module that comprises a first vacuum source, a first vacuum propagation path, a second vacuum source, and a second vacuum propagation path;
wherein the first vacuum source is configured to provide first vacuum of a first vacuum level, via the first vacuum propagation path, to a chuck that is mounted on a mechanical stage;
wherein the first vacuum source is external to the mechanical stage;
wherein the second vacuum source is configured to provide second vacuum at a second vacuum level, via the second vacuum propagation path, to the chuck;
wherein the second vacuum source is external to the mechanical stage;
wherein the second vacuum level exceeds the first vacuum level;
wherein the chuck is configured to apply at least one of the first vacuum or the second vacuum to the wafer;
and
wherein the first vacuum propagation path is configured to follow movements of the chuck, wherein the second vacuum propagation path is configured to remain static despite the movements of the chuck.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application: 18/106,324Filed 6 Feb 2023
Published: 8 Aug 2024
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

H10P 72/78
For supporting or gripping: using vacuum or suction, e.g. Bernoulli chucks
H10P 72/0616
Apparatus for monitoring, sorting, marking, testing or measuring: monitoring of warpages, curvatures, damages, defects or the like
H10P 72/50
Handling or holding of wafers, substrates or devices during manufacture or treatment thereof: for positioning, orientation or alignment
H10P 72/7618
The wafers being placed on a susceptor, stage or support: characterised by a movable susceptor, stage or support, others than those only rotating…

Family

US 12,293,936 B2Related patent
US 2024/0266204 A1This patent

From the US filing history. Foreign family members aren’t listed.

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