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US 2024/0266197 A1Published application
Working system for semiconductor packaging process and operation method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsTang-Hsin KUO, Chin-Chih HSIAO, Hung-Wen CHIEN, I HSU
Life of this patent
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Abstract
A working system for a semiconductor packaging process includes a machine equipment, a supply unit and a return device. The supply unit is correspondingly connected to the machine equipment and includes an input device and an output device. The return device is connected to the input device and the output device. As such, a magazine is transferred from the input device to the output device via the return device, thereby accelerating the operation speed of a production line.
Claims26
A working system for a semiconductor packaging process, comprising:
- a machine equipment defined with a process starting end, a process ending end, and a process path connected to the process starting end and the process ending end;
- a supply unit correspondingly connected to the machine equipment and including an input device connected to the process starting end of the machine equipment and an output device connected to the process ending end of the machine equipment, wherein the input device is configured with a magazine for carrying a target material;
- and
- a return device connected to the input device and the output device to transport the magazine from the input device to the output device.
1 more element
Dependencies are inferred from the claim text.