Working system for semiconductor packaging process and operation method thereof

A working system for a semiconductor packaging process, comprising:

• a machine equipment defined with a process starting end, a process ending end, and a process path connecting the process starting end and the process ending end;
• and
• a supply unit correspondingly connected to the machine equipment and including an input device connected to the process starting end of the machine equipment, an output device connected to the process ending end of the machine equipment, and at least one pick-and-place device disposed on at least one of the input device and the output device, wherein the pick-and-place device is used to input a magazine carrying a target material to the input device and/or output the magazine carrying the target material from the output device.