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US 2024/0265990 A1Published application
Apparatus with circuit-locating mechanism
AssigneeMicron Technology, Inc.
InventorsItamar Lavy, Chunhao Wang, Wesley B. Butler
Life of this patent
Estimating the term…
Abstract
An apparatus includes a substrate; circuit components disposed on the substrate; and a location identifier layer over the circuit, wherein the location identifier layer includes one or more section labels for representing physical locations of the circuit components within the apparatus.
Claims20
An apparatus, comprising:
- a substrate;
- circuit components disposed on the substrate;
- a planar mesh over the circuit components and including one or more section labels configured to provide locational reference to the circuit components;
- and
- a protective layer over the planar mesh.
2 more elements
A method of manufacturing an apparatus, the method comprising:
- providing a substrate;
- forming circuit components on the substrate;
- forming one or more section labels over the circuit, wherein the one or more section labels are (1) included on a planar mesh that is over the circuit components and (2) located relative to the circuit components for providing locational reference to the circuit components;
- and
- forming a protective layer over the planar mesh.
2 more elements
A semiconductor device, comprising:
- a substrate;
- circuitry on the substrate, wherein the circuitry is along at least one lateral plane;
- a planar mesh over the circuitry, wherein the planar mesh includes filler material forming a letter, a number, a symbol, or a combination thereof configured to provide locational reference to the circuitry;
- and
- an encapsulant over the top metal layer, the circuit layer, and the substrate.
2 more elements
Dependencies are inferred from the claim text.