Back to results
US 2024/0260191 A1Published application
Stacked power design in a card-based computing device
AssigneeNVIDIA Corporation
InventorsSien CHEN, Xuan WANG, Ziyi XU
Life of this patent
Estimating the term…
Abstract
According to various embodiments, a processing subsystem includes a first printed circuit board (PCB); a processor mounted directly on a first side of the first PCB; and one or more power components. The one or more power components are coupled to a second side of the first PCB and electrically coupled to the processor, where the first side of the first PCB is opposite to the second side of the first PCB.
Claims20
A processing subsystem, comprising:
- a first printed circuit board (PCB);
- a processor mounted directly on a first side of the first PCB;
- and
- one or more power components that are coupled to a second side of the first PCB and electrically coupled to the processor,
- wherein the first side of the first PCB is opposite to the second side of the first PCB.
2 more elements
A computer system, comprising:
- a chassis;
- a power supply disposed within the chassis;
- a motherboard disposed that is disposed within the chassis and is electrically coupled to the power supply;
- and
- a processing subsystem that is disposed within the chassis and is communicatively coupled to the motherboard, the processing subsystem including:
- a first printed circuit board (PCB);
- a processor mounted directly on a first side of the first PCB;
- and
- one or more power components that are coupled to a second side of the first PCB and electrically coupled to the processor,
- wherein the first side of the first PCB is opposite to the second side of the first PCB.
7 more elements
Dependencies are inferred from the claim text.