Method for manufacturing optoelectronic components, and optoelectronic components

A method for producing optoelectronic components, the method comprising:

• providing at least one semiconductor wafer, which has a semiconductor layer sequence and a plurality of single diode elements arranged next to one another and connected to one another, and which respectively comprise a part of the semiconductor layer sequence;
• generating thermally induced predetermined breaking locations in the semiconductor layer sequence between the single diode elements using first laser radiation;
• arranging the semiconductor wafer on a carrier;
• and
• connecting the semiconductor wafer to the carrier by carrying out a connecting process, the single diode elements being at least partially separated from one another at the thermally induced predetermined breaking locations,
• wherein thermally induced predetermined breaking locations are generated in the carrier using second laser radiation so that the carrier has a plurality of carrier elements connected to one another, and
• wherein the carrier elements are separated from one another at the predetermined breaking locations by the connecting process.

An optoelectronic component comprising:

• a carrier;
• a semiconductor layer sequence, which is arranged on the carrier and comprises an active zone configured to generate electromagnetic radiation;
• and
• a plurality of single diode elements arranged next to one another, which are respectively formed at least partially from the semiconductor layer sequence,
• wherein the single diode elements are at least partially separated from one another.

An optoelectronic component comprising:

• a carrier element;
• and
• a single diode element, which is arranged on the carrier element and comprises a semiconductor layer stack, which has an active zone configured to generate electromagnetic radiation and at least one side face,
• wherein at least one side face of the semiconductor layer stack has traces of thermal pre-damage by first laser radiation.