Back to results
US 2024/0258364 A1Published application
Wafer level packaging process for thin film inductors
AssigneeQUALCOMM Incorporated
InventorsAnshih TSENG, Peng ZOU, Joseph DIBENE, Gerard WILLIAMS
Life of this patent
Estimating the term…
Abstract
An integrated circuit (IC) package, including an integrated circuit (IC) die including an input/output (I/O) pad, and a vertical thin-film inductor (TFI) extending vertically substantially from the I/O pad to a solder bump.
Claims30
An integrated circuit (IC) package, comprising:
- an integrated circuit (IC) die including an input/output (I/O) pad;
- and
- a vertical thin-film inductor (TFI) extending vertically substantially from the I/O pad to a solder bump.
A method of fabricating an integrated circuit (IC) package, comprising:
- providing an integrated circuit (IC) including an input/output (I/O) pad;
- forming a vertical thin-film inductor (TFI) extending vertically from substantially the I/O pad;
- and
- forming a solder bump over the vertical TFI.
1 more element
Dependencies are inferred from the claim text.