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US 2024/0258345 A1Published application
Semiconductor package in camera module
AssigneeZinitix Co., Ltd.
InventorsKyoung Won HYUN, Dong Won KIM
Life of this patent
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Abstract
Disclosed is a wafer-level chip-size package type semiconductor package having a plurality of terminals, wherein the semiconductor package has an elongated rectangular planar shape, the plurality of terminals is configured with two column arranged in the short-side direction of the semiconductor package, and each terminal comprises a circular body part and a protruding part extending outward from the body part.
Claims8
A semiconductor package, which is provided as a wafer-level chip-size package type semiconductor package (10) having a plurality of terminals (100),
- wherein the semiconductor package has an elongated and narrow rectangular planar shape,
- the plurality of terminals are arranged in two columns along a short-side direction (D1) of the semiconductor package, and
- each of the terminals comprises a circular body part (111) and a protruding part (112) extending outward from the body part.
Dependencies are inferred from the claim text.