Chip on films and display devices

A chip on film, comprising a display bonding area corresponding to bonding positions of a display panel, and comprising:

• a base;
• and
• bonding terminals, disposed on a side of the base,
• wherein in the display bonding area, the base comprises a first bonding portion and a second bonding portion, and both of the first bonding portion and the second bonding portion are provided with the bonding terminals thereon;
• the first bonding portion has an outer contour and comprises one part of outer edges of the base;
• and
• the second bonding portion comprises one or more second sub-portions, the base further comprises one or more hollow portions, and each of the second sub-portions comprises inner edges of the base surrounding one of the hollow portions.

A display device, comprising:

• a display panel, comprising signal terminals, and comprising:
• a substrate;
• and
• a driving circuit layer, disposed on a side of the substrate;
• a chip on film, disposed on a side of the substrate away from the driving circuit layer, comprising a display bonding area corresponding to bonding positions of a display panel, and comprising:
• a base;
• and
• bonding terminals, disposed on a side of the base;
• and
• conductive adhesives, connecting the signal terminals and the bonding terminals,
• wherein in the display bonding area, the base comprises a first bonding portion and a second bonding portion, and both of the first bonding portion and the second bonding portion are provided with the bonding terminals thereon;
• the first bonding portion has an outer contour and comprises one part of outer edges of the base;
• and
• the second bonding portion comprises one or more first sub-portions, the first sub-portions comprises the other part of the outer edges of the base, and the first sub-portions are concave and/or convex relative to the outer contour of the first bonding portion.