Electronic package module

Abstract

The invention provides an electronic package module including a chip, a heat-dissipation component, a carrying member, and a liquid metal. The carrying member is clamped between the chip and the heat-dissipation component. The carrying member has a porous structure. The liquid metal is filled in the porous structure to be in thermal contact with the chip and the heat-dissipation component. The liquid metal is constrained between the chip and the heat-dissipation component by the carrying member and does not flow outside of the chip and the heat-dissipation component.

Dependencies are inferred from the claim text.