Semiconductor apparatus including cooler for cooling semiconductor element

A semiconductor apparatus provided with a semiconductor element and a cooler for cooling the semiconductor element, the cooler comprising:

• a cooling case including a pair of first and second side walls, a pair of third and fourth side walls, an introduction port provided on the first side wall, an discharge port provided on the second side wall, a bottom wall, an inclined surface arranged in front of the introduction port and continuously formed with the bottom wall, and an inclined surface arranged behind the discharge port and continuously formed with the bottom wall;
• a heat dissipation board provided between the semiconductor element and the cooling case;
• and
• a plurality of metal protrusions provided on the lower surface of the heat dissipation board,
• wherein the plurality of metal protrusions overlaps each inclined surface in a plan view.

A semiconductor apparatus provided with a semiconductor element and a cooler for cooling the semiconductor element, wherein the cooler comprises:

• a cooling case including a pair of first and second side walls, a pair of third and fourth side walls, an introduction port provided on the first side wall, and a discharge port provided on the second side wall;
• a heat dissipation board provided between the semiconductor element and the cooling case;
• and
• metal protrusions provided on a lower surface of the heat dissipation board,
• wherein the metal protrusions comprise a plurality of fins constituting first metal protrusions, and a plurality of second metal protrusions which are provided at an outer side from the first metal protrusions and have an external shape corresponding to at least one of the first side wall, the second side wall, the third side wall and the fourth side wall.