Substrate support apparatus and method for manufacturing substrate using the same

A method for manufacturing a substrate, comprising:

• positioning a plurality of supports at a standby position so as not to overlap a substrate whose edge is supported on a substrate holder of a chamber;
• positioning the plurality of supports to a support position and lowering a chucking plate disposed on the substrate;
• supporting the substrate by raising the plurality of supports, and chucking the substrate to the chucking plate by applying a voltage to the chucking plate;
• lowering the support portions and moving the supports to the standby position;
• attaching a mask having an opening to the substrate by lowering the chucking plate, and evaporating an organic material from a source and depositing the organic material on the substrate;
• supporting the substrate, on which the organic material is deposited, by moving the plurality of support portions to the support position and then raising the supports;
• turning-off the voltage applied to the chucking plate;
• and
• supporting the edge of the substrate on which the organic material is deposited on the substrate holder by lowering the plurality of supports.

A method for manufacturing a substrate comprising:

• positioning a plurality of pin assemblies at a standby position not overlapping a substrate whose edge is supported on a substrate holder of a chamber;
• rotating the plurality of pin assemblies to be positioned at a support position and lowering a chucking plate placed on the substrate;
• supporting the substrate by raising the plurality of pin assemblies, and chucking the substrate to the chucking plate by applying a voltage to the chucking plate;
• lowering and rotating the plurality of pin assemblies to be positioned at the standby position;
• attaching a mask having an opening to the substrate by lowering the chucking plate, and evaporating an organic material from a source and depositing the organic material on the substrate;
• supporting the substrate, on which the organic material is deposited, by moving the plurality of pin assemblies to the support position and then raising the pin assemblies;
• turning-off the voltage applied to the chucking plate;
• and
• supporting the edge of the substrate on which the organic material is deposited on the substrate holder by lowering the plurality of pin assemblies.