Systems and methods for semiconductor wafer transport
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWen-Hao Cheng, Hsuan-Chih Chu, Yen-Yu Chen
Life of this patent
Estimating the term…
Abstract
A device includes a movable blade having a first surface to receive a semiconductor wafer. The device can include a positional sensor to detect a position of the semiconductor wafer on a surface of the movable blade, relative to a stationary body. The movable blade can be configured to move relative to the stationary body to cause a displacement of the semiconductor wafer relative to the movable blade. The positional sensor can be coupled to the movable blade.
Claims20
A device, comprising:
- a movable blade configured to receive a semiconductor wafer;
- and
- a positional sensor configured to detect a position of the semiconductor wafer on a surface of the movable blade, relative to a stationary body;
- wherein the movable blade is further configured to move with respect to the stationary body to cause a displacement of the semiconductor wafer relative to the movable blade;
- and
- the positional sensor is physically coupled to the movable blade.
An electric front end machine (EFEM), comprising:
- a process chamber;
- a movable blade coupled to a blade receiver and configured to receive a semiconductor wafer;
- and
- a positional sensor to detect a position of the semiconductor wafer on a surface of the movable blade, relative to a stationary body;
- wherein the EFEM is configured to adjust a position of the movable blade, responsive to the detected position of the positional sensor;
- and
- the positional sensor is physically coupled to the movable blade.
A method for fabricating semiconductor devices, comprising:
- detecting a position of a semiconductor wafer with respect to a movable blade by a sensor coupled to the movable blade;
- comparing the position of the semiconductor wafer to a position threshold;
- adjusting a position of the movable blade based on the comparison to the position threshold;
- adjusting the position of the movable blade to couple the semiconductor wafer to the movable blade;
- and
- transporting the semiconductor wafer coupled to the movable blade.
Dependencies are inferred from the claim text.