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AssigneeHORIBA STEC, Co., Ltd.
InventorsDaisuke HAYASHI, Kotaro TAKIJIRI
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A wafer temperature control device controls a temperature of a wafer by adjusting pressure of a gas, predicts future a temperature, and controls the temperature to a target temperature. The wafer is placed on a temperature adjusted plate and the gas is supplied between the plate and the wafer to control the wafer temperature. The control device comprises a pressure regulator that adjusts the pressure of the gas, a sensor that measures the vicinity temperature of the wafer, and a pressure control unit that controls a pressure operation amount input to the pressure regulator by model predictive control based on the vicinity temperature and target temperature of the wafer, and the pressure control unit uses a model, in which a heat transfer coefficient between the plate and the wafer is a variable obtained from the pressure of the gas, as a predictive model for the model predictive control.
A wafer temperature control device in which a wafer is placed on a temperature adjusted plate and that controls a temperature of the wafer by supplying a gas between the plate and the wafer, comprising:
A wafer temperature control method for controlling a temperature of a wafer by placing the wafer on a temperature adjusted plate and supplying a gas between the plate and the wafer, wherein
A non-transitory computer-readable medium storing a wafer temperature control program used in a wafer temperature control device in which a wafer is placed on a temperature adjusted plate, a gas is supplied between the plate and the wafer to control the temperature of the wafer, and which comprises a pressure regulator to adjust the pressure of the gas, and a vicinity temperature sensor to measure the vicinity temperature of the wafer, the wafer temperature control program being executable to cause a computer to:
Dependencies are inferred from the claim text.