Electronic component cleaning apparatus
AssigneeYamaha Robotics Holdings Co., Ltd.
InventorsHiroshi KIKUCHI, Kinn RI
Life of this patent
Estimating the term…
Loading patent…
AssigneeYamaha Robotics Holdings Co., Ltd.
InventorsHiroshi KIKUCHI, Kinn RI
Estimating the term…
An electronic component cleaning apparatus for cleaning a surface of a wafer includes: a wet cleaning unit, a dry cleaning unit, a transport unit and a control unit. The control unit; performs the wet cleaning of the surface of the wafer by the wet cleaning unit; transports the wafer that has been cleaned to the dry cleaning unit; performs the dry cleaning of the surface of the wafer with atmospheric pressure plasma by the dry cleaning unit; transports the wafer that has been dry-cleaned to the wet cleaning unit; and performs a hydrogen water treatment to hydrophilize the surface of the wafer using hydrogen water in which hydrogen gas is dissolved in water.
An electronic component cleaning apparatus for cleaning a surface of an electronic component, comprising:
Dependencies are inferred from the claim text.