Treatment device and method for the treatment of semiconductor objects

A method for treating semiconductor objects (2) with an aqueous treatment fluid, comprising

• storing at least two different treatment chemicals or aqueous solutions of different treatment chemicals in at least two correspondingly configured chemical containers (9, 10, 11) of a chemical supply unit (8),
• providing water, in particular deionized water by means of a water supply unit (19), wherein at least one water line (20, 21, 22) of the water supply unit (19) is connected to a mixing unit (28) of the supply device (7) and the water is fed to the mixing unit (28) by means of this at least one water line (20, 21, 22) connected to the mixing unit,
• retrieval of the at least two treatment chemicals or aqueous solutions of treatment chemicals from the at least two chemical containers (9, 10, 11) and feed of the at least two treatment chemicals or aqueous solutions of treatment chemicals to the mixing unit (28) by means of at least two chemical transport lines (13, 14, 15) and at least two chemical conveying devices (16, 17, 18), said two chemical transport lines (13, 14, 15) respectively being assigned downstream to the at least two chemical containers (13, 14, 15), and said at least two chemical conveying devices being assigned respectively to the at least two chemical containers (13, 14, 15,
• formation of the aqueous treatment fluid by combining the at least two treatment chemicals or aqueous solutions of treatment chemicals and the water in the mixing unit (28), such that in the mixing unit (28) the at least one water line (20, 21, 22) of the water supply unit (19) and the at least two chemical transport lines (13, 14, 15) of the chemical supply unit (8) are connected directly or indirectly and/or via at least one openable and closable shut-off means (25) with a single treatment fluid feed line (24),
• and feeding of the aqueous treatment fluid into a treatment chamber (3) by guiding the aqueous treatment solution to distribution means (5) arranged in the treatment chamber (3) via the single treatment fluid feed line (24),
• wherein the aqueous treatment fluid is distributed via the distribution means (5) arranged in the treatment chamber (3) onto the semiconductor objects (2) held inside the treatment chamber (3) by holding means (4).