Package structure having thermal dissipation structure therein and manufacturing method thereof

A package structure, comprising:

• a thermal dissipation structure, comprising:
• a semiconductor substrate;
• conductive vias embedded in the semiconductor substrate;
• a thermal transmission structure disposed on the semiconductor substrate and the conductive vias, wherein the thermal transmission structure comprises a conductive plane;
• bonding pads and bonding vias embedded in the thermal transmission structure, wherein the bonding vias are located between the conductive vias and the bonding pads, and the conductive plane is in physical contact with sidewalls of at least one of the bonding pads;
• and
• capacitors embedded in the thermal transmission structure and located between the conductive vias and the conductive plane;
• and
• a first semiconductor die bonded to the bonding pads of the thermal dissipation structure.

A manufacturing method of a package structure, comprising:

• forming a thermal dissipation structure, comprising:
• providing a semiconductor substrate having first conductive vias and second conductive vias embedded therein;
• forming capacitors over the semiconductor substrate, the first conductive vias, and the second conductive vias;
• forming a thermal transmission structure over the semiconductor substrate, the first conductive vias, and the second conductive vias such that the capacitors are at least partially embedded in the thermal transmission structure, wherein the thermal transmission structure comprises a first conductive plane;
• forming first bonding vias over the first conductive vias and second bonding vias over the second conductive vias;
• and
• forming bonding pads on the first bonding vias and the second bonding vias, wherein the first conductive plane is in physical contact with sidewalls of at least one of the bonding pads.