Focus ring and plasma treatment device
AssigneeKYOCERA Corporation
InventorMasao YOSHIDA
Life of this patent
Estimating the term…
Abstract
A focus ring according to the present disclosure includes a placement surface accommodating a substrate to be treated and facing a lower surface of the substrate to be treated, and a back surface located on an opposite side to the placement surface. An average value of a cutting level difference (Rδc) representing a difference between a cutting level at a load-length ratio of 25% in a roughness curve and a cutting level at a load-length ratio of 75% in the roughness curve is greater in a supported portion of the back surface supported by one support member than in the placement surface.
Claims18
A focus ring, comprising:
- a placement surface accommodating a substrate to be treated and facing a lower surface of the substrate to be treated;
- and
- a back surface located on an opposite side to the placement surface, wherein
- an average value of a cutting level difference (Rδc) representing a difference between a cutting level at a load-length ratio of 25% in a roughness curve and a cutting level at a load-length ratio of 75% in the roughness curve is greater in a supported portion of the back surface supported by one support member than in the placement surface.
A focus ring, comprising:
- a placement surface accommodating a substrate to be treated and facing a lower surface of the substrate to be treated;
- and
- a back surface located on an opposite side to the placement surface, wherein
- an average value of a cutting level difference (Rδc) representing a difference between a cutting level at a load-length ratio of 25% in a roughness curve and a cutting level at a load-length ratio of 75% in the roughness curve is greater in a supported portion on an innermost peripheral side of the back surface supported by a plurality of support members than in the placement surface.
Dependencies are inferred from the claim text.