Substrate support with real time force and film stress control
AssigneeApplied Materials, Inc.
InventorsWendell Glenn BOYD, JR., Govinda RAJ, Matthew James BUSCHE
Life of this patent
Estimating the term…
Abstract
Embodiments disclosed herein include a substrate support having a sensor assembly, and processing chamber having the same. In one embodiment, a substrate support has a puck. The puck has a workpiece support surface and a gas hole exiting the workpiece support surface. A sensor assembly is disposed in the gas hole and configured to detect a metric indicative of a deflection of a workpiece disposed on the workpiece support surface, wherein the sensor assembly is configured to allow gas to flow past the sensor assembly when positioned in the gas hole.
Claims20
A method for processing a substrate disposed on a substrate support, comprising:
- chucking a substrate to a substrate support;
- monitoring a chucking force on the substrate with a sensor disposed in a backside gas hole of the substrate support, the sensor comprising:
- a sensor assembly disposed in the gas hole and configured to detect a metric indicative of a deflection of a workpiece disposed on the workpiece support surface, wherein the sensor assembly is configured to allow gas to flow past the sensor assembly when positioned in the gas hole;
- and
- flowing a gas through the backside gas hole past the sensor.
A method for adjusting a clamping force on a substrate disposed on a substrate support, comprising:
- monitoring a chucking force on a substrate disposed on a substrate support, wherein the chucking force is monitored with a sensor disposed in a backside gas providing hole of the substrate support;
- measuring with the sensor a deflection in real-time of the substrate disposed on the substrate support;
- and
- based on the measured deflection of the substrate, adjusting the chucking force on the substrate.
A method for processing a substrate disposed on a substrate support, comprising:
- chucking a substrate to a substrate support;
- and
- monitoring a chucking force on the substrate with a sensor disposed in a backside gas hole of the substrate support, the sensor comprising:
- a sensor assembly disposed in the gas hole and configured to detect a metric indicative of a deflection of a workpiece disposed on the workpiece support surface, wherein the sensor assembly is configured to allow gas to flow past the sensor assembly when positioned in the gas hole.
Dependencies are inferred from the claim text.