Wafer visual inspection apparatus and wafer visual inspection method
AssigneeSumco Corporation
InventorTatsuya OSADA
Life of this patent
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Abstract
The visual inspection apparatus comprises a controller that generates a plurality of overall images of a wafer surface including part images taken by dividing the wafer surface into a plurality of areas along the circumferential direction, generates an average image based on the plurality of overall images, and detects abnormalities on the wafer surface based on the average image.
Claims18
A visual inspection apparatus comprising a controller that generates a plurality of overall images of a wafer surface including part images taken by dividing the wafer surface into a plurality of areas along the circumferential direction, generates an average image based on the plurality of overall images, and detects abnormalities on the wafer surface based on the average image.
A visual inspection method including,
- generating a plurality of overall images of a wafer surface including part images taken by dividing the wafer surface into a plurality of areas along the circumferential direction,
- generating an average image based on the plurality of overall images, and
- detecting abnormalities on the wafer surface based on the average image.
Dependencies are inferred from the claim text.