Wiring substrate
AssigneeIbiden Co., Ltd.
InventorMasatoshi KUNIEDA
Life of this patent
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Abstract
A wiring substrate includes an insulating layer, a conductor pad that is formed on a surface of the insulating layer and is connected to a component such that the insulating layer has a component region that is covered by the component connected to the conductor pad, and an optical waveguide including a core part that transmits light and is positioned on an outer side of the component region of the insulating layer such that the core part has an end surface exposed and facing a component region side. The optical waveguide is positioned such that the end surface of the core part is adjacent to the component region.
Claims20
A wiring substrate, comprising:
- an insulating layer;
- a conductor pad formed on a surface of the insulating layer and configured to be connected to a component such that the insulating layer has a component region configured to be covered by the component connected to the conductor pad;
- and
- an optical waveguide comprising a core part configured to transmit light and positioned on an outer side of the component region of the insulating layer such that the core part has an end surface exposed and facing a component region side,
- wherein the optical waveguide is positioned such that the end surface of the core part is adjacent to the component region.
Dependencies are inferred from the claim text.