Apparatus for plating and method of manufacturing apparatus for plating
AssigneeEbara Corporation
InventorMasaki TOMITA
Life of this patent
Estimating the term…
Loading patent…
AssigneeEbara Corporation
InventorMasaki TOMITA
Estimating the term…
One object of the present disclosure is to facilitate maintenance of components placed in a lower portion of a face down-type apparatus for plating. There is provided an apparatus for plating, comprising: a plating tank configured to store a plating solution therein; a substrate holder configured to hold a substrate in such a state that a plating surface of the substrate faces down; and a drawer unit mounted to the plating tank to be freely drawable in a horizontal direction and provided with an anode that is placed to be opposed to the substrate in the plating tank and with a variable anode mask that includes an opening which the anode is exposed from and that is configured to adjust an opening size of the opening.
An apparatus for plating, comprising:
A method of manufacturing an apparatus for plating, the method comprising:
Dependencies are inferred from the claim text.