Polymer, leveling agent and preparation method thereof, electroplating solution, and electroplating method

A polymer preparation method comprising:

• performing a polymerization reaction on a binary epoxy compound and a nitrogen-containing compound in a solvent to obtain a polymer, wherein the polymer comprises a plurality of repeating units, each of the plurality of repeating units comprises a binary epoxy compound residual group and a nitrogen-containing group, and the nitrogen-containing group comprises an alkyl group, and a dimethylamine group and a nitrogen-containing heterocyclic group that are respectively connected to two ends of the alkyl group, wherein the dimethylamine group is further connected to the binary epoxy compound residual group through a single bond, and wherein
• a residue formed after an epoxy bond of the binary epoxy compound is ring-opened is used as the binary epoxy compound residual group;
• and
• the nitrogen-containing compound comprises:
• an alkyl group, and an amine group and a nitrogen-containing heterocyclic group that are respectively connected to two ends of the alkyl group, wherein a residue formed after the amine group of the nitrogen-containing compound participates in the polymerization reaction is used as the nitrogen-containing group.

The use of a polymer in preparation of a leveling agent, wherein the polymer comprises a plurality of repeating units, and each of the plurality of repeating units comprises:

• a binary epoxy compound residual group i-s-being a residue formed after an epoxy bond of a binary epoxy compound is ring-opened;
• and
• a nitrogen-containing group comprises:
• an alkyl group, and a dimethylamine group and a nitrogen-containing heterocyclic group that are respectively connected to two ends of the alkyl group, wherein the dimethylamine group is further connected to the binary epoxy compound residual group through a single bond.

An electroplating solution comprising:

• a leveling agent comprising a polymer, wherein the polymer comprises a plurality of repeating units, and each of the plurality of repeating units comprises:
• a binary epoxy compound residual group being a residue formed after an epoxy bond of a binary epoxy compound is ring-opened;
• and
• a nitrogen-containing group comprising:
• an alkyl group, and a dimethylamine group and a nitrogen-containing heterocyclic group that are respectively connected to two ends of the alkyl group, wherein the dimethylamine group is further connected to the binary epoxy compound residual group through a single bond.