US 2024/0253177 A1 · POLISHING PAD WITH ENDPOINT DETECTION WINDOW

Abstract

A polishing pad for chemical mechanical polishing comprises a polishing layer having a top polishing surface, a sub-pad located opposite from the top polishing surface, the sub-pad comprising a sub-pad material and having a bottom sub-pad surface defining a bottom surface of the polishing pad, and a window for transmitting a signal wave through the polishing pad to a substrate to be polished and back through the polishing pad for endpoint detection, the window having a top window surface, a bottom window surface, and side edges, wherein the top window surface is recessed from the top polishing surface, the bottom window surface is substantially coplanar with the bottom sub-pad surface, and the side edges are in contact with the polishing material and the sub-pad material.

Claims10

Dependent claims

A polishing pad for chemical mechanical polishing comprising

a polishing layer having a top polishing surface and comprising a polishing material,
a sub-pad layer comprising a sub-pad material wherein the sub-pad layer is located opposite from the top polishing surface, the sub-pad layer having a bottom sub-pad surface defining a bottom surface of the pad, and
a window extending through the polishing pad for transmitting a signal wave through the polishing pad, wherein the window has a top portion that forms a seal with the polishing layer, the top portion comprising a first window material, and a bottom portion that extends from an interface with the top portion of the window toward the bottom surface of the pad and that comprises an elastomeric material wherein there is a gap between side edges of the bottom portion and the sub-pad material.

Dependencies are inferred from the claim text.

Polishing pad with endpoint detection window

Life of this patent

Polishing pad with endpoint detection window

Life of this patent

Abstract

Claims10