Multilayer electronic component and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorYang-Seok Park
Life of this patent
Estimating the term…
Abstract
In a multilayer electronic component according to an aspect or another aspect of the present disclosure, a protective layer including a plurality of oxides having a wired form is disposed on at least a portion of an external surface of a body. Alternatively or optionally, the protective layer including an oxide having a wired form is disposed on at least a portion of a space between the body and a side margin portion. A surface of the multilayer electronic component has superhydrophobicity, thereby improving moisture resistance reliability of the multilayer electronic component.
Claims40
A multilayer electronic component comprising:
- a body including a dielectric layer and an internal electrode disposed alternately with the dielectric layer in a first direction, the body having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
- an external electrode disposed on one of the third and fourth surfaces;
- and
- a protective layer including a plurality of oxides having a wired form and disposed on at least a portion of an external surface of the body.
A multilayer electronic component comprising:
- a laminate including a dielectric layer and an internal electrode disposed alternately with the dielectric layer in a first direction, the laminate having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
- a side margin portion disposed on one of the fifth and sixth surfaces;
- an external electrode disposed on one of the third and fourth surfaces;
- and
- a protective layer including a plurality of oxides having a wired form and disposed on at least a portion of a space between the laminate and the side margin portion.
A multilayer electronic component comprising:
- a laminate including a dielectric layer and an internal electrode disposed alternately with the dielectric layer in a first direction, the laminate having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
- an external electrode disposed on one of the third and fourth surfaces;
- and
- a plurality of oxide wires extending away from at least a portion of an exterior surface among the first, second, fifth, and sixth surfaces of the laminate.
A method of manufacturing a multilayer electronic component, comprising:
- forming a conductive paste layer on a surface of a ceramic green sheet;
- stacking the ceramic green sheet with the conductive paste layer and sintering to form a body;
- forming an external electrode on the body;
- and
- forming a plurality of oxide wires on an external surface of the body.
Dependencies are inferred from the claim text.