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AssigneeLignum Technologies AG
InventorsManfred Dunky, Luis Miguel Olaechea, Ingo Mayer, Reto Frei
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A temperature-curable aminoplastic adhesive resin that is a (poly)-condensate of: (i) at least one aminoplast-forming chemical; (ii) 5-hydroxymethylfurfural (5-HMF), its oligomers and/or its isomers; and, (iii) at the least one second (poly-)condensable chemical. Composite boards, such as wood-based panels, can be produced using this adhesive resin. The production of the aminoplastic adhesive resin includes the reaction of urea with 5-hydroxymethylfurfural (5-HMF) and glyoxal. The adhesive resin can be used in the production of wood-based panels such as particleboards, fiberboards and products usually called, among others, plywood and/or blockboards.
A temperature-curable resin preparable by the (poly)-condensation of:
A method for the production of a temperature-curable resin, the method comprising (poly)-condensation of at least one aminoplast-forming chemical with 5-hydroxymethylfurfural (5-HMF), its oligomers and/or its isomers, and at the least one second (poly-)condensable chemical, under reaction conditions under which said at least one aminoplast-forming chemical, 5-hydroxymethylfurfural (5-HMF), its oligomers and/or its isomers, and the at least one second (poly-)condensable chemical (poly-)condensate to the temperature-curable resin.
Dependencies are inferred from the claim text.