Ceramic wafer and manufacturing method thereof

Abstract

A ceramic wafer includes an upper surface and a lower surface, and the ceramic wafer includes at least one curved surface. A manufacturing method of the ceramic wafer includes the steps of: performing a high-temperature sintering process on a ceramic green body to produce a ceramic material; and performing a processing process on the ceramic material to form the ceramic wafer, wherein the processing process is used to change the shape of the ceramic material and thereby form the ceramic wafer. The ceramic wafer and the manufacturing method thereof are advantageous in that by forming a warped or bowed ceramic wafer, it is made possible for the surface tension or surface internal stress resulting from forming a thick integrated circuit film on the ceramic wafer to pull the ceramic wafer into a relatively flat configuration suitable for subsequent manufacturing processes that require wafer flatness.

Dependencies are inferred from the claim text.