Component mounter and electronic component imaging method

A component mounter for mounting an electronic component on a board, the component mounter comprising:

• a board conveyance device configured to convey the board to a work position in the component mounter;
• a component supply device configured to supply the electronic component;
• a nozzle configured to pick up the electronic component supplied from the component supply device;
• a component moving device that is capable of moving the nozzle between the component supply device and the work position and rotating the nozzle about an axis of the nozzle;
• an imaging device disposed between the component supply device and the board conveyance device and configured to image the electronic component, which is picked up by the nozzle, from below;
• and
• a control device configured to, in a case where the electronic component picked up by the nozzle interferes with an electronic component previously mounted on the board conveyed to the work position when the nozzle is translated in a plane parallel to a surface of the board such that the electronic component picked up by the nozzle is disposed in the entire imaging range of the imaging device, when the electronic component picked up by the nozzle is imaged by the imaging device, cause the component moving device to rotate the nozzle at a position at which the electronic component picked up by the nozzle does not interfere with the previously mounted electronic component and cause the imaging device to image the electronic component, which is picked up by the nozzle, from below before and after the nozzle is rotated about the axis.