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US 2024/0239950 A1Published application
Curable resin composition
AssigneeThreebond Co., Ltd.
InventorNaoya OTSUKI
Life of this patent
Estimating the term…
Abstract
A curable resin composition containing components (A) to (E) below: (A) a compound having two or more glycidyl groups in one molecule (excluding a component (B)); (B) a glycidyl group-containing acrylic polymer; (C) a tackifier having a phenol skeleton and an OH value of 100 or more; (D) an inorganic filler; and (E) a curing agent. One embodiment of the present invention is an adhesive for structure that has high flexibility and is excellent in resin strength, adhesive strength, and toughness coefficient.
Claims9
A curable resin composition comprising components (A) to (E) below:
- (A) a compound having two or more glycidyl groups in one molecule (excluding a component (B));
- (B) a glycidyl group-containing acrylic polymer;
- (C) a tackifier having a phenol skeleton and an OH value of 100 or more;
- (D) an inorganic filler;
- and
- (E) a curing agent.
3 more elements
Dependencies are inferred from the claim text.