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AssigneesNational University Corporation Nagaoka University of Technology, Sanoh Industrial Co., Ltd.
InventorsHideo Aida, Natsuko Omiya
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Provided are a polishing state analysis prediction program, a storage, a cathodeluminescence device, and a polishing state analysis prediction method. The polishing state analysis prediction program to predict a future polishing state of a polishing-target substrate to be polished based on a cathodeluminescence image of the polishing-target substrate, the image being obtained by a cathodeluminescence method, the program, when executed by a computer, causing the computer to perform: calculating average light emission intensity data or average luminance data from the cathodeluminescence image of each predetermined time after start of polishing the substrate; and plotting the average light emission intensity data or the average luminance data, and deriving a formula representing a fitting curve resulted from the plotting by using a predetermined function.
A polishing state analysis prediction program to predict a future polishing state of a polishing-target substrate to be polished based on a cathodeluminescence image of the polishing-target substrate, the image being obtained by a cathodeluminescence method, the program, when executed by a computer, causing the computer to perform:
A cathodeluminescence device configured to predict a future polishing state of a polishing-target substrate to be polished based on a cathodeluminescence image of the polishing-target substrate, the image being obtained by a cathodeluminescence method, the device comprising:
A computer-implemented polishing state analysis prediction method to predict a future polishing state of a polishing-target substrate to be polished based on a cathodeluminescence image of the polishing-target substrate, the image being obtained by a cathodeluminescence method, the polishing state analysis prediction method comprising:
Dependencies are inferred from the claim text.