Contact structure and a gate line slit and merge method to form thereof
AssigneeYangtze Memory Technologies Co., Ltd.
InventorsZuixin ZENG, Xianghui ZHAO, Junxiong WANYAN, Chuan ZHANG, Haiqing DOU
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AssigneeYangtze Memory Technologies Co., Ltd.
InventorsZuixin ZENG, Xianghui ZHAO, Junxiong WANYAN, Chuan ZHANG, Haiqing DOU
Estimating the term…
Aspects of the disclosure provide a semiconductor device. The semiconductor device includes a substrate and a stack of alternative layers including insulating layers and gate layers that are stacked alternatively over the substrate. The stack of alternative layers includes an array region and a contact region. The semiconductor device includes channel structures disposed through the stack of alternative layers in the array region. Each channel structure forms a stack of transistors in a series configuration with the gate layers being gate terminals of the stack of transistors. The semiconductor device includes contact structures disposed in the contact region. Each contact structure electrically connects to one of the gate layers. The semiconductor device includes gate line trenches disposed through the stack of alternative layers in the array region and in the contact region. The gate line trenches are formed during the formation of the contact structures in the contact region.
A method of manufacturing a semiconductor device, comprising:
A semiconductor device, comprising:
A memory system, comprising:
Dependencies are inferred from the claim text.