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US 2024/0206154 A1Published application
Semiconductor device and method for fabricating the same
AssigneeSK hynix Inc.
InventorsYu Jin KIM, Dong Hyun LEE, Se Hun KANG, Kyung Woong PARK
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Abstract
A semiconductor device includes: a data storage element including a first electrode disposed over a semiconductor substrate, wherein the first electrode includes: a pillar body which is oriented perpendicular to a surface of the semiconductor substrate and which includes a tapered sidewall; and a sealing layer covering the tapered sidewall of the pillar body.
Claims20
A semiconductor device comprising:
- a data storage element including a first electrode disposed over a semiconductor substrate,
- wherein the first electrode includes:
- a pillar body which is oriented perpendicular to a surface of the semiconductor substrate and which includes a tapered sidewall;
- and
- a sealing layer covering the tapered sidewall of the pillar body.
2 more elements
A method for fabricating a data storage element, comprising:
- sequentially forming a first electrode, a dielectric layer, and a second electrode, at least the first electrode including a vertical sidewall disposed over a semiconductor substrate,
- wherein the forming of the first electrode including the vertical sidewall includes:
- forming a pillar body having a tapered sidewall over the semiconductor substrate;
- forming a sealing layer on the tapered sidewall of the pillar body;
- and
- selectively etching the sealing layer to form the vertical sidewall.
3 more elements
Dependencies are inferred from the claim text.