Apparatus and method for mounting component
AssigneeHanwha Precision Machinery Co., Ltd.
InventorEun Ho CHOI
Life of this patent
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Abstract
An apparatus for mounting a component includes: a head including a nozzle and a substrate recognition camera; a first correction camera generating a first image by capturing an image of a component adsorbed to the nozzle and disposed at a first height; a second correction camera generating a second image by capturing an image of the component adsorbed to the nozzle and disposed at a second height; and a controller obtaining a mounting offset of the component by comparing the first image and the second image with each other and controlling the head so that the component is mounted on the substrate in a state in which the mounting offset is applied.
Claims20
An apparatus for mounting a component, comprising:
- a head comprising at least one nozzle;
- a first correction camera configured to generate a first image by capturing an image of a component adsorbed to the nozzle and disposed at a first height;
- a second correction camera configured to generate a second image by capturing an image of the component adsorbed to the nozzle and disposed at a second height;
- and
- a controller configured to obtain a mounting offset of the component by comparing the first image and the second image with each other, and control the head based on the mounting offset.
A method for mounting a component, comprising:
- generating a first image by capturing an image of a component adsorbed to a nozzle provided in a head and disposed at a first height;
- generating a second image by capturing an image of the component adsorbed to the nozzle and disposed at a second height;
- obtaining a mounting offset of the component by comparing the first image and the second image with each other;
- and
- controlling the head based on the mounting offset.
Dependencies are inferred from the claim text.